JPH0627279Y2 - 集積回路用はんだ - Google Patents
集積回路用はんだInfo
- Publication number
- JPH0627279Y2 JPH0627279Y2 JP9199289U JP9199289U JPH0627279Y2 JP H0627279 Y2 JPH0627279 Y2 JP H0627279Y2 JP 9199289 U JP9199289 U JP 9199289U JP 9199289 U JP9199289 U JP 9199289U JP H0627279 Y2 JPH0627279 Y2 JP H0627279Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- ribbon
- integrated circuit
- present
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 21
- 238000000034 method Methods 0.000 description 15
- 239000000428 dust Substances 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9199289U JPH0627279Y2 (ja) | 1989-08-03 | 1989-08-03 | 集積回路用はんだ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9199289U JPH0627279Y2 (ja) | 1989-08-03 | 1989-08-03 | 集積回路用はんだ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0331088U JPH0331088U (en]) | 1991-03-26 |
| JPH0627279Y2 true JPH0627279Y2 (ja) | 1994-07-27 |
Family
ID=31641443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9199289U Expired - Lifetime JPH0627279Y2 (ja) | 1989-08-03 | 1989-08-03 | 集積回路用はんだ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0627279Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6891686B2 (ja) * | 2017-07-18 | 2021-06-18 | 大日本印刷株式会社 | シート状ロウ材および熱交換器の製造方法 |
-
1989
- 1989-08-03 JP JP9199289U patent/JPH0627279Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0331088U (en]) | 1991-03-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |